Selection of materials for reduced stress packaging of a microsystem

Sensors and Actuators, A: Physical

Volumn 74, Issue 1, 1999, Pages 178-181

  Morrissey, A ^a   Kelly, G ^a   Alderman, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MICROMACHINING; PLASTICS; STRESSES; THERMAL EXPANSION;

MICROPUMP; MICROSYSTEM PACKAGING;

MICROSENSORS;

EID: 0032680768     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00335-5     Document Type: Article

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