Microindentation Tests of Single Crystal Silicon-Microdeformation Behavior and Measurement of Ductile to Brittle Transition -

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 64, Issue 11, 1998, Pages 1643-1647

  Koshimizu, Shigeomi ^a   Otsuka, Jiro ^a  

^a NONE

Author keywords

AE; brittle mode; ductile mode; ductile to brittle transition; microindentation; plastic deformation energy; single crystal silicon

Indexed keywords

EID: 0141852736     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.64.1643     Document Type: Article

References (4)

1. B. Lawn et al.: Brittleness as an Indentation Size Effect, J. Mater. Sci. Lett., 11 (1976) 575.
2. T. Bifano, T.A. Dow and R. Scattergood: Ductile-regime Grinding: A New Technology for Machining Brittle Materials, ASME, J. Eng. Ind, Vol. 113, (1991) 184.
3. T.Sata, K. Yamamoto and K. Yoshikawa: Ultra-Micro Indentation Hardness Tester, Bull. Japan Soc. Prec. Eng., 3, 1 (1969) 13.
4. T.Bifano and S.C.Fawcett: Specific Grinding Energy as an In-process Control Variable for Ductile-regime Grinding, Prec. Eng., 13, 4 (1991) 256.