Chemical and physical properties of copper and nitrogen plasma-implanted polyethylene

Plasma Processes and Polymers

Volumn 4, Issue 2, 2007, Pages 158-164

  Zhang, Wei ^a,b,d   Ji, Junhui ^b   Zhang, Yihe ^c   Yan, Qing ^b   Chu, Paul K ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^c CHINA UNIVERSITY OF GEOSCIENCES   (China)

^d UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Copper; Plasma immersion ion implantation; Polyethylene; XPS

Indexed keywords

CHEMICAL PROPERTIES; COPPER; FUNCTIONAL GROUPS; NITROGEN; PHYSICAL PROPERTIES; POLYETHYLENES; POLYMER MATRIX; SURFACE TREATMENT;

ANTIBACTERIAL PROPERTIES; PLASMA IMMERSION ION IMPLANTATION (PIII);

PLASMA APPLICATIONS;

EID: 33947212026     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.200600196     Document Type: Article

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