Controlling the resistivity of fine line Cu interconnects

Advanced Metallization Conference (AMC)

Volumn 2006, Issue , 2006, Pages 117-121

  Khoo, Khyoupin ^a   Onuki, Jin ^a   Nagano, Takahiro ^a   Chonan, Yasunori ^b   Akahoshi, Haruo ^c   Tobita, Toshimi ^c   Chiba, Masahiro ^c   Saito, Tatsuyuki ^c   Ishikawa, Kensuke ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b AKITA PREFECTURAL UNIVERSITY   (Japan)

^c HITACHI LTD   (Japan)

Author keywords

Cu interconnects; Longitudinal microstructure; Mean free path; Resistivity; ULSI

Indexed keywords

ASPECT RATIO; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC WINDINGS; GRAIN SIZE AND SHAPE;

CU INTERCONNECTS; GRAIN SIZE DISTRIBUTIONS; LONGITUDINAL MICROSTRUCTURE; MEAN FREE PATH;

OPTICAL INTERCONNECTS;

EID: 33947193019     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. K. Hinode, Y. Hanaoka, K. Takeda and S. Kondo, "Resisitivity Increase in Ultrafine-Line Copper Conductor for ULSIs," Jpn. J. Appl. Phys., Vol. 40, 2001, L1097.
2. W. Steinhögl, G. Schindler, G. Steinlesberger and M. Engelhardt, "Size-Dependent Resistivity of Metallic Wires in the Mesoscopic Range," Phys. Rev. B 66, 2002, pp. 075414.
3. The International Technology Roadmap for Semiconductors, 2005.
4. G. Steinlesberger, M. Engelhardt, G. Schindler, and W. Steinhögl, "Electrical Characterization of Copper Interconnects with End-of Roadmap Feature Sizes," Solid-State Electron, Vol. 47, 2003, pp. 1233-1237.
5. W. Wu, S. H. Brongersma, M. Van Hove and K. Maex, "Influence of Surface and Grain-Boundary Scattering on the Resistivity of Copper in Reduced Dimensions," Appl. Phys. Lett. 84, 2004, pp.2838-2840.
6. K.P. Khoo, J. Onuki, T. Nagano, Y. Chonan, H. Akahoshi, T. Tobita, M. Chiba, T. Saito and K. Ishikawa, "Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects," Jpn. J. Appl. Phys. 45 (2006) L852-853.