Reaction between Sn-In solder and under bump metallurgy

Materials Science Forum

Volumn 449-452, Issue I, 2004, Pages 401-404

  Choi, J H ^a   Jung, B Y ^a   Jun, S W ^a   Kim, Y H ^b   Oh, T S ^a  

^a Hong Ik University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

48Sn 52In; Chip on glass; Intelmetallic compound; Reflow; Solder; UBM

Indexed keywords

FLAT PANEL DISPLAYS; INTERMETALLICS; LIQUID CRYSTAL DISPLAYS; LIQUID CRYSTALS; MAGNETRON SPUTTERING; METALLURGY; MORPHOLOGY; POLARIZATION; REACTION KINETICS; SHEAR STRENGTH; TIN ALLOYS;

48SN-52IN; CHIP ON GLASS; REFLOW; SOLDERS; UNDER BUMP METALLURGIES (UBM);

SOLDERING ALLOYS;

EID: 3142665593     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.449-452.401     Document Type: Conference Paper

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