Increasing bondability and bonding strength of gold stud bumps onto copper pads with a deposited titanium barrier layer

Microelectronic Engineering

Volumn 84, Issue 4, 2007, Pages 551-559

  Chuang, Cheng Li ^a  

^a CHUNG SHAN MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Copper pads; Silver bonding layer; Stud bump bonding; Titanium barrier layer

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GOLD; METALLIC FILMS; MICROELECTRONICS; TITANIUM;

COPPER FILMS; COPPER PADS; MICROELECTRONICS PACKAGING; STUD BUMP BONDING (SBB); WAFER BUMPING;

STUDS (FASTENERS);

EID: 33847685270     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.11.005     Document Type: Article

References (10)

1. Gilleo K. Area Array Packaging Handbook: Manufacturing and Assembly (2001), McGraw-Hill, New York p. 7.12
2. Lin K.L., and Liu Y.T. IEEE Transactions on Advanced Packaging 22 (1999) 580
3. Klein M., Oppermann H., Kalicki R., Aschenbrenner R., and Reichl H. Microelectronics Reliability 39 (1999) 1389
4. Gilleo K. Area Array Packaging Handbook: Manufacturing and Assembly (2001), McGraw-Hill, New York p. 7.14
5. G. Deltoro, N. Sharif, in: 24th IEEE/CPMT, 1999, pp. 185-188.
6. Chuang C.L., Aoh J.N., and Din R.F. Microelectronics Reliability 46 (2006) 449
7. Aoh J.N., and Chuang C.L. Journal of Electronic Materials 33 (2004) 310
8. Aoh J.N., and Chuang C.L. Journal of Electronic Materials 33 (2004) 299
9. Chuang C.L., and Aoh J.N. Journal of Electronic Materials 35 (2006) 1693
10. EIA/JEDEC STANDARD, Wire Bond Shear Test, EIA/JESD22-B116, Electronic Industrial Alliance, Arlington, VA, 1998.