Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 4, 1999, Pages 580-585

  Lin, Kwang Lung ^a   Liu, Ya Te ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b United Microelectronics Corporated Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; FLIP CHIP DEVICES; INTERDIFFUSION (SOLIDS); METALLURGY; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING SILICON; SOLDERED JOINTS; SPUTTER DEPOSITION; TANTALUM;

SOLDER BUMPS; UNDER BUMP METALLURGY (UBM);

ELECTRONICS PACKAGING;

EID: 0033356408     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.803449     Document Type: Article

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