Mathematical modeling of CMP conditioning process

Microelectronic Engineering

Volumn 84, Issue 4, 2007, Pages 577-583

  Chang, Onemoon ^a   Kim, Hyoungjae ^a   Park, Kihyun ^a   Park, Boumyoung ^a   Seo, Heondeok ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

Author keywords

CMP; Conditioning process; Kinematic analysis; MRR; Sliding distance; Velocity profile

Indexed keywords

COMPUTER SIMULATION; GLAZES; MATHEMATICAL MODELS; POLISHING MACHINES; SERVICE LIFE; VELOCITY MEASUREMENT; WEAR OF MATERIALS;

CONDITIONING PROCESS; KINEMATIC ANALYSIS; MATERIAL REMOVAL RATE (MRR); MATHEMATICAL MODELING; POLISHING PADS; POLISHING RATE; SLIDING DISTANCE;

CHEMICAL MECHANICAL POLISHING;

EID: 33847622077     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.11.011     Document Type: Article

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