Influence of substrate bias on the composition of SiC thin films fabricated by PECVD and underlying mechanism

Surface and Coatings Technology

Volumn 201, Issue 15, 2007, Pages 6777-6780

  Wang, M ^a   Diao, X G ^a   Huang, A P ^b   Chu, Paul K ^b   Wu, Z ^a  

^a BEIHANG UNIVERSITY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Film; PECVD; SiC; Substrate bias

Indexed keywords

COMPOSITION EFFECTS; SILICON CARBIDE; STOICHIOMETRY; SUBSTRATES; THIN FILMS;

SUBSTRATE BIAS;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

COMPOSITION EFFECTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON CARBIDE; STOICHIOMETRY; SUBSTRATES; THIN FILMS;

EID: 33847410598     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.09.065     Document Type: Article

References (15)

1. Matsunami H., Nishino S., and Ono H. IEEE Trans. Electron Devices ED-28 (1981) 1235
2. Nishino S., POwll J.A., and Will H.A. Appl. Phys. Lett. 42 (1983) 460
3. He Z., Inone S., Garter G., Kheyrandish H., and Colligon J.S. Thin Solid Films 260 (1995) 37
4. Yan H., Wang B., Song X.M., and Chen G.H. Thin Solid Films 368 (2000) 241
5. Wolter S.D., Stoney B.R., and Glass J.T. Appl. Phys. Lett. 62 (1993) 15
6. Wang B., Liu W., Wang G.J., Liao B., Wang J.J., Zhu M.K., Wang H., and Yan H. Mater. Sci. Eng., B, Solid-State Mater. Adv. Technol. 98 (2003) 190
7. Yan H., Kwok R.W.M., and Wong S.P. Appl. Surf. Sci. 92 (1996) 76
8. Jeynes C., Jafri Z.H., Webb R.P., Kimber A.C., and Ashwin M.J. Surf. Interface Anal. 25 (1997) 254
9. Wang B.B., Wang W.L., Liao K.J., and Xiao J.L. Phys. Rev., B 63 (2001) 085412
10. Spitzer W.G., Kleinman D.A., and Frosch C.J. Phys. Rev. 113 (1959) 135
11. Desalvo A., Giorgis F., Pirri C.F., Tresso E., Rava P., Galloni R., Rizzoli R., and Summontes C. J. Appl. Phys. 81 (1997) 7973
12. Mckenzie D.R. J. Phys. D: Appl. Phys. 18 (1985) 1935
13. Lee Y.H., Richard P.D., and Bachmann K.J. Appl. Phys. Lett. 56 (1990) 620
14. Stoner B.R., and Ma G.H. Phys. Rev., B 45 (1992) 11067
15. Anglada J., Bruna P.J., Peyerimhoff S.D., and Buenker R.J. J. Phys. B: Mol. Phys. 16 (1983) 2469