Wafer level processing on re-built wafer for chip staking

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 140-143

  Souriau, Jean Charles ^a   Lignier, Olivier ^b   Val, Christian ^b   Charrier, Michel ^c   Poupon, Gilles ^a  

^a CEA GRENOBLE   (France)

^b 3D PLUS ^*  (France)

^c THALES AVIONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DYNAMIC RANDOM ACCESS STORAGE; FLASH MEMORY; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; STATIC RANDOM ACCESS STORAGE;

3D INTERCONNECTIONS; PACKAGING COST; WATER LEVEL PACKAGING;

SILICON WAFERS;

EID: 33847335627     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. M Karnezos "Stacked-die Packaging - Technology Toolbox" Advanced Packaging - August 2004, pp. 41-44.
2. R Tummala "SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade" Advanced Packaging, IEEE Transactions ,Volume: 27, Issue: 2, May 2004, pp.241-249
3. M Umemoto et al "High-Performance Vertical Interconnection for high density 3D Chip Stacking Package" 54th Electronic Components and Technology Conf, Las Vegas, Nevada, May 2004, pp. 616-623.
4. J Barton et al "Development and Characterization of Ultra Thin Autonomous Modules for Ambient System Applications Using 3D Packaging Techniques" 54th Electronic Components and Technology Conf, Las Vegas, Nevada, May 2004, pp.635-641.
5. G Poupon "Main progress on Wafer Level Packaging for Smart Card, RF and 3D applications" International Wafer Level Packaging Congress, October 10-12, 2004, San Jose, California
6. J-C Souriau et al "Wafer Level Processing Of 3D System In Package For RF And Data Applications" 55th Electronic Components and Technology Conf, Orlando, Florida, May 2005, pp.356-361.
7. C Val, "New approaches to 3-D interconnection - Systems in Package applications", International Conference on Electronics Packaging (Formerly IEMT/IMC Symposium), April 14-16, 2004, Japan, pp. 428-433