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Volumn 1, Issue , 2004, Pages 635-641

Development and characterisation of ultra thin autonomous modules for ambient system applications using 3D packaging techniques

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; CHEMICAL SENSORS; MICROCONTROLLERS; PROJECT MANAGEMENT; RELIABILITY; RESISTORS;

EID: 10444237975     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (16)

References (15)
  • 1
    • 10444287763 scopus 로고    scopus 로고
    • Systems integration and packaging requirements for ambient intelligence
    • Espoo, September
    • th IMAPS Nordic Conf, Espoo, September 2003, pp. 13-21
    • (2003) th IMAPS Nordic Conf , pp. 13-21
    • Delaney, K.1
  • 3
    • 0038414402 scopus 로고    scopus 로고
    • Miniaturised modular wireless sensor networks
    • September 29 - October 1, Göteborg, Sweden
    • Barton, J. et al "Miniaturised Modular Wireless Sensor Networks," UbiComp 2002, September 29 - October 1, 2002, Göteborg, Sweden.
    • (2002) UbiComp 2002
    • Barton, J.1
  • 4
    • 0038414401 scopus 로고    scopus 로고
    • Functional integration for embedded intelligence
    • December 10-11
    • Barton, J. et al, "Functional Integration for Embedded Intelligence," ICEWES 2002, December 10-11, 2002,
    • (2002) ICEWES 2002
    • Barton, J.1
  • 5
    • 0037674530 scopus 로고    scopus 로고
    • Development of distributed sensing systems of autonomous micro-modules
    • New Orleans, May
    • Barton, J. et al, "Development of Distributed Sensing Systems of Autonomous Micro-Modules," Proc. 53rd Electronic Component and Technology Conf, New Orleans, May 2003, pp.
    • (2003) Proc. 53rd Electronic Component and Technology Conf
    • Barton, J.1
  • 6
    • 0035422827 scopus 로고    scopus 로고
    • High density interconnects for flexible hybrid assemblies for active biomedical implants
    • Meyer JU. et al, "High Density Interconnects for Flexible Hybrid Assemblies for Active Biomedical Implants," IEEE Trans. on Advance Packaging, Vol 24, No 3, (2001), pp 366-374
    • (2001) IEEE Trans. on Advance Packaging , vol.24 , Issue.3 , pp. 366-374
    • Meyer, J.U.1
  • 9
    • 0006751699 scopus 로고    scopus 로고
    • 2.5.6.3, Dielectric Breakdown Voltage and Dielectric Strength
    • IPC TM-650 Test Method Manual, 2.5.6.3, Dielectric Breakdown Voltage and Dielectric Strength
    • IPC TM-650 Test Method Manual
  • 10
    • 0032279692 scopus 로고    scopus 로고
    • Surface studies of polyimide thin films via surface-enhanced raman scattering and second harmonic generation
    • Ge JJ. "Surface Studies of Polyimide Thin Films Via Surface-Enhanced Raman Scattering and Second Harmonic Generation," Macromol Rapid Commun Vol 19, (1998), pp. 619-623
    • (1998) Macromol Rapid Commun , vol.19 , pp. 619-623
    • Ge, J.J.1
  • 11
    • 0033365635 scopus 로고    scopus 로고
    • FTIR spectroscopy and FTIR microscopy of vacuum-evaporated polyimide thin films
    • Karamancheva I. "FTIR Spectroscopy and FTIR Microscopy of Vacuum-Evaporated Polyimide Thin Films," Vibrational Spectroscopy Vol 19, (1999), pp. 369-73
    • (1999) Vibrational Spectroscopy , vol.19 , pp. 369-373
    • Karamancheva, I.1
  • 12
    • 0344240194 scopus 로고    scopus 로고
    • Flip chip interconnect using anisotropic conductive adhesive
    • Sarkar G. et al; "Flip Chip Interconnect using Anisotropic Conductive Adhesive;" Journal of Material Processing Technology; Vol 89-90; (1999), pp 484-490
    • (1999) Journal of Material Processing Technology , vol.89-90 , pp. 484-490
    • Sarkar, G.1
  • 14
    • 0035340717 scopus 로고    scopus 로고
    • Reliability of 80μM pitch flip chip attachment on flex
    • Palm P. et al, "Reliability of 80μM Pitch Flip Chip Attachment on Flex," Microelectronic Reliability, 41, (2001), pp. 633-638
    • (2001) Microelectronic Reliability , vol.41 , pp. 633-638
    • Palm, P.1
  • 15
    • 0028497118 scopus 로고
    • Test chips, test systems and thermal test data for multi-chip modules in the ESPRIT-APACHIP project
    • O'Mathuna, S.C. et al, "Test chips, test systems and thermal test data for multi-chip modules in the ESPRIT-APACHIP project," IEEE Trans. Comp. Pack. Manu. Tech., A.; Vol. 17, (1994)
    • (1994) IEEE Trans. Comp. Pack. Manu. Tech., A. , vol.17
    • O'Mathuna, S.C.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.