Interconnecting fluidic packages and interfaces for micromachined sensors

Sensors and Actuators, A: Physical

Volumn 134, Issue 1, 2007, Pages 278-285

  Pepper, Michael ^a   Palsandram, Naveenkumar S ^a   Zhang, Peng ^a   Lee, Moosung ^b   Cho, Hyoung J ^a  

^a University of Central Florida   (United States)

^b Chonnam National University   (South Korea)

Author keywords

Interconnection; Microfluidic package; Portable analysis system; Sensor interface

Indexed keywords

INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROPROCESSOR CHIPS;

INTERCONNECTING FLUIDIC PACKAGES; INTERCONNECTION; MICROFLUIDIC PACKAGE; PORTABLE ANALYSIS SYSTEM; SENSOR INTERFACE;

ELECTROCHEMICAL SENSORS;

EID: 33847272616     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.06.028     Document Type: Article

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