Effect of reverse pulse current on the internal stress of electroformed nickel

Journal of Materials Processing Technology

Volumn 63, Issue 1-3, 1997, Pages 819-822

  Chan, K C ^a   Qu, N S ^b   Zhu, D ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Electroformed nickel; Internal stress; Reverse pulse current

Indexed keywords

DIMENSIONAL STABILITY; ELECTRIC CURRENTS; ELECTRIC FIELD EFFECTS; ELECTROFORMING; RESIDUAL STRESSES; SCHEMATIC DIAGRAMS;

REVERSE PULSE CURRENT; X RAY STRESS ANALYZER;

NICKEL;

EID: 0030830485     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(96)02731-8     Document Type: Article

References (4)

1. Trevor Pearson, Keith Dennis, Plating and Surface Finishing, 76(11)(Nov.1989) 64
2. A. Maner, S. Harsch and W. Ehrfeld, Plating and Surface Finishing, 175(3) (March 1988) 60-65.
3. G.P. Xiang, Theory and Practice of Reverse pulse current Electroplating, Tianjin Science-Technology press, (1989)(in Chinese).
4. S. W. Zhou, Theory and Research Methods of Metal Deposit, Shanghai Science-Technology press,(1987)(in Chinese).