1 Gb stacked solution of multilevel NOR flash memory packaged in a LFBGA 8 mm by 10 mm by 1.4 mm of thickness

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Dellutri, M ^a   Pulici, P ^b   Guarnaccia, D ^a   Stoppino, P ^a   Vanalli, G ^a   Lessio, T ^a   Vassallo, F ^a   Di Stefano, R ^a   Labriola, G ^a   Tenerello, A ^a   Lo Iacono, F ^a   Campardo, G ^a  

^a STMICROELECTRONICS   (Italy)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; MICROELECTRONICS; SIGNAL INTERFERENCE; WIRELESS TELECOMMUNICATION SYSTEMS;

CRITICAL NODES; PORTABLE DEVICES; STACKED PACKAGE; Z-DIMENSION;

FLASH MEMORY;

EID: 33847171961     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1643997     Document Type: Conference Paper

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