Ultra thin chips for miniaturized products

Microsystem Technologies

Volumn 9, Issue 6-7, 2003, Pages 449-452

  Jung, E ^a   Ostmann, A ^a   Wojakowski, D ^a   Landesberger, C ^b   Aschenbrenner, R ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

^b TU ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC CONTACTS; EMBEDDED SYSTEMS; ETCHING; INTEGRATED CIRCUITS; MICROMACHINING; MINIATURE INSTRUMENTS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING SILICON; THERMAL VARIABLES MEASUREMENT;

MINIATURIZATION;

CHIP SCALE PACKAGES;

EID: 0242412380     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0264-9     Document Type: Article

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