Chip-in-polymer: Volumetric packaging solution using PCB technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 46-49

  Jung, Erik ^a   Wojakowski, Dirk ^a   Neumann, Alexander ^a   Landesberger, Christof ^a   Ostmann, Andreas ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER CONCENTRATION; DIELECTRIC MATERIALS; ELECTRIC CONTACTS; MICROCRACKS; PLASMA ETCHING; POLYMERS; PRINTED CIRCUIT BOARDS; SILICON WAFERS; STRESSES; THERMODYNAMIC PROPERTIES;

BALL GRID ARRAY; CHIP THINNING; CHIP-IN-POLYMER; SYSTEM-IN-PACKAGE; THERMAL MANAGEMENT; ULTRA THIN CHIP; ULTRA THIN PACKAGE;

ELECTRONICS PACKAGING;

EID: 0036396839     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2002.1032721     Document Type: Article

References (22)

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