The challenges of electronic cooling: Past, current and future

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 491-500

  Chu, Richard C ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BOUNDARY LAYERS; ELECTRONIC EQUIPMENT; FLUOROCARBONS; HEAT FLUX; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; INTERFACES (MATERIALS); LAMINAR FLOW; REYNOLDS NUMBER; SEMICONDUCTOR DEVICES; THERMAL CONDUCTIVITY OF LIQUIDS;

DIELECTRIC COOLANTS; ELECTRONIC COOLING; THERMOELECTRIC COOLING TECHNOLOGY; TURBULATORS;

COOLING SYSTEMS;

EID: 13944269247     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1839594     Document Type: Review

References (23)

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3. Seely, J. H., and Chu, R. C., 1972, Heat Transfer in Microelectronic Equipment, Dekker, New York.
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