High thermal performance silicon heat spreaders with microwhisker structure

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 426-432

  Hammel, E ^a   Nagl, C ^a   Nicolics, J ^a   Hanreich, G ^a  

^a Electrovac GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TRANSFER COEFFICIENTS; POWER ELECTRONICS; SEMICONDUCTING SILICON; SUBSTRATES; SURFACE PROPERTIES; TEMPERATURE MEASUREMENT; THERMODYNAMIC STABILITY;

MICROWHISKER STRUCTURE; SILICON HEAT SPREADERS;

ELECTRONICS PACKAGING;

EID: 0033337785     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)