Constructal peripheral cooling of a rectangular heat-generating area

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 432-440

  Da Silva, Alexandre K ^a   Gosselin, Louis ^b  

^a University of Hawaii at Manoa   (United States)

^b UNIVERSITÉ LAVAL   (Canada)

Author keywords

Compactness; Constructal design; Electronic cooling; Forced convection; Heat transfer density; Packing

Indexed keywords

COMPACTION; COOLING; FORCED CONVECTION; HEAT TRANSFER; OPTIMIZATION; THERMAL CONDUCTIVITY;

CONSTRUCTAL DESIGN; ELECTRONIC COOLING; HEAT TRANSFER DENSITY; THERMAL GLOBAL CONDUCTANCE;

FLOW OF SOLIDS;

EID: 33846674213     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351909     Document Type: Article

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