Assessment of overall cooling performance in thermal design of electronics based on thermodynamics

Journal of Heat Transfer

Volumn 123, Issue 5, 2001, Pages 999-1005

  Ogiso, K ^a  

^a TOKYO UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Entropy generation; Heat transfer; Pressure loss; Thermal design

Indexed keywords

COOLING; HEAT TRANSFER; OPTIMIZATION; THERMODYNAMICS;

THERMAL DESIGN;

ELECTRONIC EQUIPMENT;

COOLING; ELECTRONIC EQUIPMENT; ENTROPY; HEAT TRANSFER ENHANCEMENT; OPTIMIZATION; PRESSURE LOSS;

EID: 0035472227     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1387025     Document Type: Article

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