Relationships between mechanical strength and electrical conductivity for Cu-Ag filamentary microcomposites

Applied Physics A: Materials Science and Processing

Volumn 86, Issue 4, 2007, Pages 529-532

  Liu, J B ^a   Zhang, L ^b   Meng, L ^a  

^a ZHEJIANG UNIVERSITY   (China)

^b UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER ALLOYS; ELECTRIC CONDUCTIVITY; STRAIN RATE; STRENGTH OF MATERIALS; THERMAL EFFECTS;

CONDUCTING LOSS; DISPERSIVE PRECIPITATION; INTERFACE SCATTERING; LATTICE DISTORTION;

COMPOSITE MATERIALS;

EID: 33846634904     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-006-3807-6     Document Type: Article

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