Influence of solidification conditions, thermomechanical processing, and alloying additions on the structure and properties of in situ composite Cu-Ag alloys

Scripta Materialia

Volumn 41, Issue 10, 1999, Pages 1123-1130

  Morris, D G ^a   Benghalem, A ^a   Morris Munoz M A ^a  

^a UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COLD WORKING; ELECTRIC CONDUCTIVITY OF SOLIDS; GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; PLASTIC FLOW; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; STRAIN HARDENING; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

COPPER SILVER ALLOY; STRUCTURAL REFINEMENT;

COPPER ALLOYS;

EID: 0033313799     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00262-6     Document Type: Article

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