High-quality inkjet-printed multilevel interconnects and inductive components on plastic for ultra-low-cost RFID applications

Materials Research Society Symposium - Proceedings

Volumn 769, Issue , 2003, Pages 253-258

  Molesa, Steven ^a   Redinger, David R ^a   Huang, Daniel C ^a   Subramanian, Vivek ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CHEMICAL VAPOR DEPOSITION; DIELECTRIC FILMS; ETCHING; LITHOGRAPHY; NETWORKS (CIRCUITS); OPTIMIZATION; PHYSICAL VAPOR DEPOSITION; PLASTICS; PRINTING; THIN FILMS; TRANSISTORS;

MULTILEVEL INTERCONNECTS; PRINTED ELECTRONICS;

ELECTRONIC EQUIPMENT;

EID: 1542274518     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-769-h8.3     Document Type: Conference Paper

References (5)

1. H. Sirringhaus et al, Science, vol. 290, pp. 2123, 2000.
2. V. Subramanian, "Towards Printed Low-Cost RFID Tags: Device, Materials and Circuit Technologies", V. Subramanian, Proceedings of the 2nd Advanced Technology Workshop on Printing an Intelligent Future: Printed Organic and Molecular Electronic Technologies, Boston, MA, March 16-19, 2003.
3. D. Huang, F. Liao, S. Molesa, D. Redinger, and V. Subramanian, "Plastic-compatible low-resistance printable gold nanoparticle conductors for flexible electronics", in print, J. Electrochem. Soc.
4. Fuller et al, J. Micromechanical Systems, vol. 11, pp. 54, 2002.
5. D. Redinger, R. Farshchi, and V. Subramanian "Inkjetted Passive Components on Plastic Substrate for RFID", to be presented, 2003 IEEE Device Research Conference.