Integrated metrology and wafer-level control

Semiconductor International

Volumn 29, Issue 6, 2006, Pages 44-54

  Lensing, Kevin ^a   Stirton, Broc ^a  

^a AMD

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33846146403     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. A. Braun, "Process Complexity Fuels Integrated Metrology," Semiconductor International, July 2005, p. 54.
2. NIST/Sematech e-Handbook of Statistical Methods. Available at: www.itl.nist.gov/div898/handbook.
3. A. Toprac, "Dynamic Tuning Algorithm and Other Strategies for Handling Dead Time," Proc. of AEC/APC Symp. XVII, September 2005.
4. L. Karuppiah, A. Ravid, B. Swedek and W.Y. Hsu, "Overview of CMP Process Control Strategies," Proc. CMP-MIC, February 2006, p. 125.
5. J. Qian, D. Li, J. Jiang and A. Huang, "Using APC for Wafer-to-Wafer Control in CMP," Solid State Technology, May 2004, p. 63.
6. K.R Lensing et al., "A Comprehensive Comparison of Spectral Scatterometry Hardware," Proc. SPIE Microlithography, March 1, 2005.
7. A. Holfeld, R. Good and R. Barlovic, "A Fab-wide APC Sampling Application," Proc. 7th Euro, AEC/APC Conf., March 2006.