Using APC for wafer-to-wafer control in CMP

Solid State Technology

Volumn 47, Issue 5, 2004, Pages 63-66

  Huang, Andrew ^a   Jiang, Jifeng ^a   Li, Daoqiang ^b,c   Qian, Jun ^b  

^a Grace Semiconduct Mfg Corp   (China)

^b APPLIED MATERIALS INC   (United States)

^c Applied Materials China Inc   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PROCESS CONTROL (APC); FEEDFORWARD CONTROL; ONBOARD METROLOGY; PROCESS CONTROL ALGORITHM;

ALGORITHMS; CLOSED LOOP CONTROL SYSTEMS; COMPUTER SOFTWARE; DATA REDUCTION; DIELECTRIC MATERIALS; FEEDBACK CONTROL; MATHEMATICAL MODELS; POLISHING; PRODUCTION ENGINEERING; SEMICONDUCTOR DEVICE MANUFACTURE; TRANSFER FUNCTIONS;

PROCESS CONTROL;

EID: 2942700045     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. D.S.L. Mui, et al., "Advanced Gate Process Critical Dimension Control in Semiconductor Manufacturing," Intl. Symposium on Semiconductor Manufacturing, September 2003.
2. I. Wang, et al., "Comparison and Analysis of Different Removal Rate Models in Run-to-Run Control of the Oxide CMP Process," AEC/APC Symposium XV, September 2003.
3. G. Behm, et al., "CMP Film Thickness Control Solution for IBM 300mm Fab," AEC/APC Symposium XV, September 2003.