Design and modeling of a thermally regulated communications module for nanospacecraft

Journal of Spacecraft and Rockets

Volumn 43, Issue 6, 2006, Pages 1377-1386

  Kratz, Henrik ^a,b   Karlsson, Mikael ^a,b   Eriksson, Anders ^a,b   Köhler, Johan ^a,b   Stenmark, Lars ^a,b   Thornell, Greger ^a,b  

^a UPPSALA UNIVERSITY   (Sweden)

^b UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ARRAYS; DATA TRANSFER; HEAT SINKS; NANOTECHNOLOGY; PHASE CHANGING CIRCUITS; THERMOANALYSIS; TRANSCEIVERS;

NANOSPACECRAFT; THERMAL SWITCHES; THERMAL TRANSPORT;

SPACE APPLICATIONS;

EID: 33846119131     PISSN: 00224650     EISSN: 15336794     Source Type: Journal    
DOI: 10.2514/1.20398     Document Type: Article

References (32)

1. Eriksson, A., and Stenmark, L., "Cold Gas Micro Thrusters - Final Edition," AIAA Paper 2002-5765, Sept. 2002.
2. Williams, K., Eriksson, A., Thorslund, R., Köhler, J., Boman, M., and Stenmark, L., "Micro-Coil Heaters for Improved Performance in Cold/Hot Gas Microthrusters in Silicon," 3rd International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (Power MEMS), 2003, pp. 53-56.
3. Köhler, J., Bejhed, J., Kratz, H., Bruhn, F., Lindberg, U., Hjort, K., and Stenmark, L., "A Hybrid Cold Gas Microthruster System for Spacecraft," Sensors and Actuators A (Physical), Vol. A97-98, April 2002, pp. 587-598.
4. Janson, S., Helvajian, H., and Robinson, E., "The Concept of "Nanosatellite" for Revolutionary Low-Cost Space Systems," International Astronautical Federation Paper IAF-93-U.5.573, 1993.
5. Kratz, H., Öiefors, E., and Stenmark, L., "Micromachined S-band Patch Antenna with Reduced Dielectric Constant," Sensors and Actuators A (Physical), Vols. 130-131, Aug. 2006, pp. 478-484.
6. Böhnke, T., Edoff, M., and Stenmark, L., "Development of a MOEMS Sun Sensor for Space Applications," Sensors and Actuators A (Physical), Vols. 130-131, Aug. 2006, pp. 28-36.
7. Shan, X. C., Wang, Z. F., Jin, Y. F., Wu, J., Hua, J., Wong, C. K., and Maeda, R., "Studies on a Micro Combustor for Gas Turbine Engines," Journal of Micromechanics and Microengineering, Vol. 15, 2005, pp. S215-S221.
8. Zencik, R. G., Jr., and Kohlhepp, K., "GPS Micro Navigation and Communication System for Clusters of Micro and Nanosatellites," 2007 IEEE Aerospace Conference Proceedings, Vol. 5, IEEE, Piscataway, NJ, 2001, pp. 2515-2522.
9. Bushuev, D., Kedar, D., and Arnon, S., "Analyzing the Performance of a Nanosatellite Cluster-Detector Array Receiver for Laser Communication," Journal of Lightwave Technology, Vol. 21. No. 2, 2003. pp. 447-455.
10. Esper, J., Neeck, S., Slavin, J., Wiscombe, W., and Bauer, F., "Nano/Micro Satellite Constellations for Earth and Space Science," Acta Astronautica, Vol. 52, Nos. 9-12, May-June 2003, pp. 785-791.
11. Esper, J., Panetta, P., Ryschkewitsch, M.. Wiscombe, W., and Neeck, S., "NASA-GSFC Nano-Satellite Technology for Earth Science Missions," Acta Astronautica, Vol. 46. Nos. 2-6, Jan.-March 2000. pp. 287-296.
12. Kratz, H., Köhler, J., and Stenmark, L., "Nanospacecraft Technology and its Predicted Consequences for the Space Community," IEEE Transactions on Aerospace and Electronic Systems, (submitted for publication).
13. Bruhn, F., Köhler, J., and Stenmark, L., "Nanospace-1 : The Impacts of the First Swedish Nanosatellite on Spacecraft Architecture and Design," Acta Astronautica. Vol. 53, Nos. 4-10, Aug.-Nov. 2003. pp. 633-643.
14. Anon., "Space Engineering: Radio Frequency and Modulation," European Cooperation for Space Standardization (ECSS) Paper ECSS-E-50-05A, Jan. 2003.
15. Haas, R., and Zimmermann, P., "22-GHz Measurements of Dielectric Constants and Loss Tangents of Castable Dielectrics at Room and Cryogenic Temperatures," IEEE Transactions on Microwave Theory and Techniques. Vol. MTT-24, No. 11, 1976, pp. 881-883.
16. Carrillo-Ramirez, R., and Jackson, R., "A Highly Integrated Millimeter-Wave Active Antenna Array Using BCB and Silicon Substrate," IEEE Transactions on Microwave Theory and Techniques, Vol. 52, No. 6, 2004, pp. 1648-1653.
17. Madou, M. J., Fundamentals of Microfabrication, 2nd ed., CRC Press, Boca Raton, FL, 2002.
18. Wensink, H., Jansen, H., Berenschot, J., and Elwenspoek, M., "Mask Materials for Powder Blasting," Journal of Micromechanics and Microengineering, Vol. 10, No. 2, 2000, pp. 175-180.
19. Giovanni, M., Flat and Corrugated Diaphragm Design Handbook, Marcel Dekker, New York, 1982.
20. Petersen, K. E., "Silicon as a Mechanical Material," Science and Technology of Microfabrication. Vol. 76, Materials Research Society, Pittsburgh, PA, 1987. pp. 99-110.
21. Petersen, K. E., "Silicon as a Mechanical Material," Proceedings of the IEEE. Vol. 70. May 1982. pp. 420-457.
22. Franca, D., and Blouin, A., "All-Optical Measurement of In-Plane and Out-of-Plane Young's Modulus and Poisson's Ratio in Silicon Wafers by Means of Vibration Modes," Measurement Science and Technology, Vol. 15, May 2004, pp. 859-868.
23. Wortman, J., and Evans, R., "Young's Modulus, Shear Modulus and Poisson's Ratio in Silicon and Germanium," Journal of Applied Physics, Vol. 36, Jan. 1965, pp. 153-156.
24. Preston, S., Bretherton, I., and Forty, C., "The Thermophysioal and Mechanical Properties of the Copper Heat Sink Material Intended for use in ITER," Fusion Engineering and Design, Vol. 66-68, 2003, pp. 441-446.
25. SCHOTT, "BOROFLOAT Borosilicate Float Glass," Product Information, Aug. 2005, http://www.schott.com.
26. Csikos, R., Keszthelyi, S., Mozes, G., and Freund, M., Paraffin Products: Properties, Technologies, Applications (Developments in Petroleum Science), Elsevier Science, New York, 1983.
27. Anon., "METSPEC 141 Alloy," MetalSpecialities, MCP Metal-Specialties, Inc., Fairfield, CT, http://www.mcp-metspec.thomasregister. com/ [cited 24 Aug. 2006].
28. Yazawa, K., Solbrekken, G., and Bar-Cohen, A., "Thermoelectric- Powered Convective Cooling of Microprocessors," IEEE Transactions on Advanced Packaging, Vol. 28, No, 2, 2005, pp. 231-239.
29. Cao, L., Krusius, J., Korhonen, M., and Fisher, T., "Transient Thermal Management of Portable Electronics Using Heat Storage and Dynamic Power Dissipation Control," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 1, 1998, pp. 113-123.
30. Krishnan, S., and Garimella, S., "Thermal Management of Transient Power Spikes in Electronics-Phase Change Energy Storage or Copper Heat Sinks?" Transactions of the ASME. Journal of Electronic Packaging, Vol. 126, No. 3, 2004, pp. 308-316.
31. Zhang, H., Pinjala, D., Joshi, Y., Wong, T., Toh, K., and Iyer, M., "Fluid Flow and Heat Transfer in Liquid Cooled Foam Heat Sinks for Electronic Packages," IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 2, 2005, pp. 272-280.
32. Lamb, J. W., "Miscellaneous Data on Materials for Millimetre and Submillimetre Optics," International Journal of Infrared and Millimeter Waves, Vol. 17, Dec. 1996, pp. 1997-2034.