Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 272-280

  Zhang, Heng Yun ^a   Pinjala, D ^a   Joshi, Yogendra K ^b   Wong, T N ^c   Toh, K C ^c   Iyer, M K ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electronics cooling; Flip chip ball grid array (FBGA); Foam heat sink (FHS); Microchannel heat sink (microchannel HS); Pressure drop; Pump power; Thermal resistance

Indexed keywords

BONDING; CHANNEL FLOW; COOLING; COPPER; FOAMS; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; INTERFACES (MATERIALS); PLATE METAL; POROSITY; PRESSURE DROP;

COPPER FOAM MATERIALS; ELECTRONICS COOLING; FLIP CHIP BALL GRID ARRAY (FBGA); FOAM HEAT SINKS (FHS); MICROCHANNEL HEAT SINK; PUMP POWER;

CHIP SCALE PACKAGES;

EID: 21144452301     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848528     Document Type: Article

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