Transient thermal management of portable electronics using heat storage and dynamic power dissipation control

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 1, 1998, Pages 113-123

  Cao, Lipeng ^a,b   Krusius, J Peter ^a,b   Korhonen, Matti A ^b   Fisher, Timothy S ^b  

^a IEEE   (United States)

^b Department of Obstetrics Gynecology   (United States)

Author keywords

Heat storage; Multispeed execution; Portable electronics; Portable system packaging; Power dissipation scheduling; Thermal management; Transient thermal management

Indexed keywords

COMPUTER SIMULATION; HEAT STORAGE; HEAT TRANSFER; INTEGRATED CIRCUIT LAYOUT; PORTABLE EQUIPMENT; POWER CONTROL; RELIABILITY; TRANSIENTS;

PORTABLE ELECTRONICS; POWER DISSIPATION CONTROL; TRANSIENT THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0032022990     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.679040     Document Type: Article

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