Creep study for fatigue life assessment of two lead-free high temperature solder alloys

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 307-312

  Liang, J ^a   Lee, P S ^a   Gollhardt, N ^a   Schroeder, S ^a   Morris, W ^a  

^a Rockwell International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; DEFORMATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FATIGUE TESTING; HIGH TEMPERATURE TESTING; HYSTERESIS; SOLDERED JOINTS; STRAIN RATE;

STRAIN ENERGY DENSITY;

SOLDERING ALLOYS;

EID: 0031378542     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)