Electrical performance and reliability of fine-pitch Cu bumpless interconnect

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1114-1118

  Shigetou, A ^a   Itoh, T ^a   Suga, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; ELECTRIC CONTACTS; ELECTRIC INSULATION; ELECTRIC RESISTANCE; FLASH MEMORY; MICROPROCESSOR CHIPS; POLYIMIDES; PROBLEM SOLVING; RELIABILITY; STRAIN;

COMPACT FLASH (CF); CONTACT RESISTANCE; INTERCONNECTION DENSITY;

OPTICAL INTERCONNECTS;

EID: 24644443831     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. rd IEMT/IMC symposium, Tokyo, Japan, 1999, pp. 217-218.
2. rd IEMT/IMC symposium, 1999, pp. 106-109.
3. th IEEE, ECTC, 2000, pp. 702-705.
4. st IEEE, ECTC, 2001, pp. 1003-1008.
5. H. Takagi, K. Kikuchi, et al., Surface activated bonding of silicon wafers at room temperature, appl. Phys. Lett., 68 (1996) pp. 2222-2224.
6. st IEEE, ECTC, 2001, pp. 755-760.
7. A. Shigetou, T. Itoh, M. Matsuo, N. Hayasaka, K. Okumura and T. Suga, Cu-Cu direct bonding for bumpless interconnect, Proc., ECS, ISTC, 2002, pp. 730-734.
8. rd IEEE, ECTC, 2003, pp. 848-852.
9. A. Shigetou, T. Itoh and T. Suga, The Direct Bonding of CMP-Cu Films by Surface Activated Bonding (SAB) Method, to be published in The Special IIB 2004 Issue of Interface Science.
10. W. R. Imler, K. D. Scholz et al., Precision flip-chip solder bump interconnects for optical packaging, trans. on components, hybrids and manufacturing technology, 15 (1992) pp. 977-982.
11. Y. Tomita, M. Tago et al., Advanced packaging technologies on 3D stacked LSI utilizing the micro interconnections and the layered microthin encapsulation, Proc. IEEE, EMAP, 2001, pp. 107-114.