Thermal and electrical characterization and modeling of thin copper layers

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 1171-1175

  Liu, Wenjun ^a   Yang, Yizhang ^b   Asheghi, Mehdi ^b  

^a University of Notre Dame   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL-RESISTANCE THERMOMETRY; GRAIN BOUNDARY SCATTERING; INTERCONNECT TECHNOLOGIES; THIN COPPER LAYERS;

COPPER; ELECTRIC RESISTANCE; ELECTRON SCATTERING; GRAIN BOUNDARIES; THERMAL CONDUCTIVITY; THERMOMETERS;

METALLIC FILMS;

EID: 33845593396     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645477     Document Type: Conference Paper

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