Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate

Surface and Coatings Technology

Volumn 201, Issue 8, 2007, Pages 4609-4618

  Ghosh, S K ^a   Limaye, P K ^a   Swain, B P ^b   Soni, N L ^a   Agrawal, R G ^a   Dusane, R O ^b   Grover, A K ^a  

^a BHABHA ATOMIC RESEARCH CENTRE   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

Author keywords

Coefficient of friction; Electrodeposition; Ni Cu multilayers; Residual stress; Tribology; Wear; XRD

Indexed keywords

ELECTRODEPOSITION; MORPHOLOGY; MULTILAYERS; PLASTIC DEFORMATION; PROFILOMETRY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; SUBSTRATES; TRIBOLOGY; WEAR OF MATERIALS; X RAY DIFFRACTION ANALYSIS;

FRICTION COEFFICIENT; MULTILAYER FILMS; SURFACE PROFILOMETRY; WEAR RATE;

NICKEL ALLOYS;

ELECTRODEPOSITION; MORPHOLOGY; MULTILAYERS; NICKEL ALLOYS; PLASTIC DEFORMATION; PROFILOMETRY; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; SUBSTRATES; TRIBOLOGY; WEAR OF MATERIALS; X RAY DIFFRACTION ANALYSIS;

EID: 33845357834     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2006.09.314     Document Type: Article

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