Optimization of ultrasonic cleaning for erosion-sensitive microelectronic components

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn 2006, Issue , 2006, Pages 191-195

  Nagarajan, R ^a   Diwan, M ^a   Awasthi, P ^a   Shukla, A ^a   Sharma, P ^a   Goodson, M ^b   Awad, S ^b  

^a INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

^b Crest Ultrasonics   (United States)

Author keywords

Cavitation; Cleaning; Erosion; Silicon wafer; Ultrasonic

Indexed keywords

CAVITATION; GRAVIMETRIC ANALYSIS; MICROELECTRONICS; OPTIMIZATION; SILICON WAFERS; TURBIDIMETERS;

ERODIBILITY; HIGH INTENSITY ULTRASONIC FIELDS; SENSITIVE SUBSTRATES; SURFACE CLEANABILITY;

ULTRASONIC CLEANING;

EID: 33751420758     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2006.1638750     Document Type: Conference Paper

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