Statistical analysis of electromigration lifetimes for Cu interconnects

AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 164-174

  Hauschildt, M ^a   Gall, M ^a   Thrasher, S ^a   Justison, P ^a   Michaelson, L ^a   Hernandez, R ^a   Kawasaki, H ^a   Ho, P S ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Cu interconnect; Electromigration; Lifetime; Reliability

Indexed keywords

EID: 33751323710     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173546     Document Type: Conference Paper

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