Molding of three-dimensional microcomponents

Proceedings of the International Conference on Manufacturing Science and Engineering

Volumn 2006, Issue , 2006, Pages

  Hung, W N P ^a   Ali, M Y ^b   Agnihotri, M M ^a   Yuan, S ^c  

^a TEXAS A AND M UNIVERSITY   (United States)

^b INTERNATIONAL ISLAMIC UNIVERSITY MALAYSIA   (Malaysia)

^c Integris Inc   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBILITY; FASTENERS; MICROELECTRONICS; MICROMACHINING; PLASTIC FLOW; POLYMERS; POLYSTYRENES; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTOR MATERIALS;

MICROCOMPONENTS; MICRODEVICES; MICROMOLDING PROCESS;

MICROELECTROMECHANICAL DEVICES;

EID: 33751260954     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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