Development of a multi-modal, flexible tactile sensing skin using polymer micromachining

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1027-1030

  Engel, J ^a   Chen, J ^a   Liu, Chang ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Biosensors; Micromachining; Polymers; Robustness; Sensor phenomena and characterization; Skin; Substrates; Temperature sensors; Thermal conductivity; Thermal sensors

Indexed keywords

ACTUATORS; BIOSENSORS; COMPOSITE MICROMECHANICS; MICROMACHINING; MICROSYSTEMS; POLYIMIDES; POLYMERS; ROBUSTNESS (CONTROL SYSTEMS); SKIN; SUBSTRATES; TEMPERATURE SENSORS; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THIN FILMS; TRANSDUCERS;

EXPERIMENTAL CHARACTERIZATION; MULTIPLE SENSORS; POLYMER SUBSTRATE; QUALITATIVE MEASUREMENTS; RELATIVE HARDNESS; RESISTANCE TEMPERATURE DEVICES; THERMAL SENSORS; THIN FILM METAL;

SOLID-STATE SENSORS;

EID: 33751224040     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1216943     Document Type: Conference Paper

References (10)

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