Modeling of power distribution networks for mixed signal applications

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2001, Pages 1117-1122

  Kim, Joong Ho ^a   Swaminathan, Madhavan ^a   Suh, Youngsuk ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Yeungnam University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; FREQUENCY DOMAIN ANALYSIS; TIME DOMAIN ANALYSIS;

MIXED SIGNAL APPLICATIONS;

ELECTRIC POWER DISTRIBUTION;

EID: 0035785359     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. R. R. Tummala, E.J. Rymaszewski, and A. G. Klopfenstein, Microelectronics Packaging Handbook 2nd Ed., Part I., New York: Chapman & Hall, 1997.
2. M. Pozar, Microwave Engineering, 2nd Ed., Chapter 4. John Wiley & Sons, 1998.
3. J. Kim and M. Swaminathan, "Modeling of Irregular Shaped Power Distribution Networks Using Transmission Matrix Method", Proceedings of the 9th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 2000, pp. 83-86.
4. S. Chun, J. Kim, N. Na, and M. Swaminathan, "Comparison of Methods for Modeling ALAN'S Power Plane Structure", Proceedings of the 9th Topical Meeting on Electrical Performance of Electronic Packaging, Oct. 2000, pp. 247-250.
5. K. Lee and A. Barber, "Modeling and Analysis of Multichip Module Power Supply Planes", IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part B, Vol. 18, No. 4, pp. 628-639, Nov.1995.