|
Volumn 89, Issue 19, 2006, Pages
|
Silicon layer transfer by hydrogen implantation combined with wafer bonding in ultrahigh vacuum
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ACTIVATION ANALYSIS;
HYDROGEN;
INTERFACES (MATERIALS);
ION IMPLANTATION;
SILICON WAFERS;
SUBSTRATES;
ULTRAHIGH VACUUM;
HYDROGEN IMPLANTATION;
PHOTOTHERMAL ACTIVATION;
SILICON LAYER TRANSFER;
ULTRAHIGH VACUUM BONDING;
ELECTRON TRANSITIONS;
|
EID: 33750918723
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.2387410 Document Type: Article |
Times cited : (4)
|
References (13)
|