New layer transfers obtained by the SmartCut Process

Journal of Electronic Materials

Volumn 32, Issue 8, 2003, Pages 829-835

  Moriceau, H ^a   Fournel, F ^a   Aspar, B ^a   Bataillou, B ^a   Beaumont, A ^a   Morales, C ^a   Cartier, A M ^a   Pocas, S ^a   Lagahe, C ^a   Jalaguier, E ^a   Soubie, A ^a   Biasse, B ^a   Sousbie, N ^a   Sartori, S ^a   Michaud, J F ^a   Letertre, F ^b   Rayssac, O ^b   Cayrefourcq, I ^b   Richtarch, C ^b   Daval, N ^b   Aulnette, C ^b   Akatsu, T ^b   Osternaud, B ^b   Ghyselen, B ^b   Mazure C ^b   more..

^a CEA GRENOBLE   (France)

^b PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

Silicon on insulator; SmartCut; Thin film transfer; Wafer bonding

Indexed keywords

BONDING; CRYSTAL ORIENTATION; ELECTRIC CONDUCTIVITY; MULTILAYERS; NANOSTRUCTURED MATERIALS; SEMICONDUCTING SILICON COMPOUNDS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

MARK PATTERNING; SILICON ON INSULATING MULTILAYER STRUCTURES; SMARTCUT; THIN FILM TRANSFER; WAFER BONDING;

THIN FILMS;

EID: 0041465723     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0196-x     Document Type: Article

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