Approach by nano- and micro-filler mixture toward epoxy-based nanocomposites as industrial insulating materials

IEEJ Transactions on Fundamentals and Materials

Volumn 126, Issue 11, 2006, Pages 1136-1143

  Imai, Takahiro ^a   Sawa, Fumio ^a   Ozaki, Tamon ^a   Shimizu, Toshio ^a   Kuge, Shin Ichi ^b   Kozako, Masahiro ^b,c   Tanaka, Toshikatsu ^b  

^a TOSHIBA CORPORATION   (Japan)

^b WASEDA UNIVERSITY   (Japan)

^c KAGOSHIMA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

Author keywords

Curing process; Dielectric and electrical insulation properties; Epoxy resin; Insulating material; Micro filler; Nano and micro filler mixture; Nano filler; Nanocomposite; Resin viscosity; Thermal expansion coefficient

Indexed keywords

INDUSTRIAL INSULATING MATERIALS; MICROFILLER; MIXTURE COMPOSITE; RESIN VISCOSITY;

CURING; ELECTRIC INSULATING MATERIALS; NANOSTRUCTURED MATERIALS; SILICA; THERMAL EXPANSION; VISCOSITY;

EPOXY RESINS;

EID: 33750913907     PISSN: 03854205     EISSN: 13475533     Source Type: Journal    
DOI: 10.1541/ieejfms.126.1136     Document Type: Article

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