Material and simulation technology for solid insulated switchgear

Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials

Volumn 3, Issue , 2003, Pages 1194-1197

  Shimizu, T ^a   Kinoshita, S ^a   Makishima, S ^a   Sato, J ^a   Sakaguchi, O ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELECTRIC POTENTIAL; ELECTRIC SWITCHGEAR; EPOXY RESINS; GELATION; GLASS TRANSITION; HEAT RESISTANCE; SILICA; STRENGTH OF MATERIALS; SULFUR COMPOUNDS; TOUGHNESS; VISCOSITY;

HIGH-CYCLE AUTOMATIC PRESSURE GELATION; SOLID INSULATED SWITCHGEAR; VACUUM INTERRUPTER;

ELECTRIC INSULATING MATERIALS;

EID: 0141939575     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. N. Masaki, T. Yoshida, and K. Kato, "Compact 66/77kV C-GIS That Meets Space-Saving Requirements," Toshiba review, vol. 52, No. 9, pp. 59-62, 1997.
2. W. M. M. Menheere and B. Noordhuis, "Safety and Reliability of Medium Voltage Switchgear with Solid Insulation of Present Day and Future Design," in Proc. 1990 3rd International Conference on Future Trends in Distribution Switchgear, No. 318, pp. 65-69, 1990.
3. Sato, et al., "New Technology for Medium Voltage Solid Insulated Switchgear", Proc. of IEEE/PES Transmission and Distribution Conference 2002, pp. 1791-1796, 2002.
4. T. Nakano, S. Makishima and Y. Inoue, "Application of Dielectric and Thermal Analysis to the Curing Epoxy Resins" in Proc. 1996 DMMA96, pp. 31-34, 1996.
5. A. J. Kinloch, D. L. Maxwell and R. J. Young, "The Fracture of Hybrid-particulate Composites", J. Mater. Sci., vol.20, p.4169, 1985.