Quantitative mapping of elastic properties of plasma-treated silica-based low-k films

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2230-2234

  Jiang, Le ^a   Geisler, Holm ^a   Zschech, Ehrenfried ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Low k; Modulus mapping; Nanoindentation; Plasma damage

Indexed keywords

INDENTATION; OXYGEN; PERMITTIVITY; SILICA;

LOW-K FILM; MODULUS MAPPING TECHNIQUE; OXYGEN PLASMA; QUASI-STATIC NANOINDENTATION;

DIELECTRIC FILMS;

EID: 33750838260     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.05.026     Document Type: Article

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