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Volumn 817, Issue , 2006, Pages 110-116

Mechanical properties of low-k materials on the nanometer scale

Author keywords

Damage; Force modulation; Low k; Nanoindentation

Indexed keywords


EID: 33751258599     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2173539     Document Type: Conference Paper
Times cited : (5)

References (6)
  • 1
    • 23844446754 scopus 로고    scopus 로고
    • Mechanical characterization techniques for Cu/Low-k structures and their importance for chip packaging
    • (Eds. D. Erb et al), MRS Conference Proceedings, Materials Research Society, Warrendale, Pennsylvania
    • H. Geisler, T. Adam, I. Zienert, H.J. Engelmann, E. Zschech, "Mechanical Characterization Techniques for Cu/Low-k Structures and their Importance for Chip Packaging" in Advanced Metallization Conference-2004 (Eds. D. Erb et al), MRS Conference Proceedings, Materials Research Society, Warrendale, Pennsylvania, 2004, pp. 47-53.
    • (2004) Advanced Metallization Conference-2004 , pp. 47-53
    • Geisler, H.1    Adam, T.2    Zienert, I.3    Engelmann, H.J.4    Zschech, E.5
  • 6
    • 33751216970 scopus 로고    scopus 로고
    • Chemical bonding in low-k dielectric materials for interconnect isolation: Characterization using XAS and EELS
    • th International Workshop", this volume
    • th International Workshop", AIP Conference Proceedings, this volume
    • AIP Conference Proceedings
    • Schmeisser, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.