Electrodeposited Ni1-xCoxnanocrystalline thin films

Journal of the Electrochemical Society

Volumn 153, Issue 12, 2006, Pages

  Park, D Y ^a   Park, K S ^a   Ko, J M ^a   Cho, D H ^b   Lim, S H ^b   Kim, W Y ^c   Yoo, B Y ^d   Myung, N V ^d  

^a Hanbat National University   (South Korea)

^b Kangwon National University   (South Korea)

^c Korea Institute of Industrial Technology   (South Korea)

^d University of California Riverside   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; ELECTROLYTES; FILM GROWTH; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; RESIDUAL STRESSES; TENSILE STRESS;

CHLORIDE BATHS; ELECTROLYTE COMPOSITION; FILM COMPOSITION; SACCHARIN;

THIN FILMS;

EID: 33750804662     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2353792     Document Type: Article

References (34)

1. J. W. Judy and R. S. Muller, J. Microelectromech. Syst., 6, 249 (1997).
2. K. Kataoka, S. Kawamura, T. Itoh, K. Ishikawa, H. Honma, and T. Suga, Sens. Actuators, A, 103, 116 (2003).
3. H. H. Yang, N. V. Myung, J. Yee, D.-Y. Park, B.-Y. Yoo, M. Schwartz, K. Nobe, and J. W. Judy, Sens. Actuators, A, 97-98, 88 (2002).
4. S. M. Allameh, J. Lou, F. Kavishe, T. Buchheit, and W. O. Soboyejo, Mater. Sci. Eng., A, 371, 256 (2004).
5. F. Czerwinski, A. Zielinska-Lipiec, and J. A. Szpunar, Acta Mater., 47, 2553 (1999).
6. C. A. Moina and M. Vazdar, Electrochem. Commun., 3, 159 (2001).
7. C.-C. Hu, C.-Y. Lin, and T.-C. Wen, Mater. Chem. Phys., 44, 233 (1996).
8. J. W. Judy, R. S. Muller, and H. H. Zappe, J. Microelectromech. Syst., 4, 162 (1995).
9. W. M. Yin, S. H. Whang, and R. A. Mirshams, Acta Mater., 53, 383 (2005).
10. K. P. Larsen, A. A. Rasmussen, J. T. Ravnkilde, M. Ginnerup, and O. Hansen, Sens. Actuators, A, 103, 156 (2003).
11. J. W. Dini, H. R. Johnson, and H. J. Saxton, J. Vac. Sci. Technol., 12, 766 (1975).
12. R. Weil, Plating, 57, 1231 (1970).
13. R. Weil, Plating, 58, 50 (1971).
14. R. Weil, Plating, 58, 137 (1971).
15. J. W. Dini, Electrodeposition-The Materials Science of Coatings and Substrates, Chap., Noyes Publications, Park Ridge, NJ (1993).
16. S. Hessami and C. W. Tobias, J. Electrochem. Soc., 136, 3611 (1989).
17. K. Y. Sasaki and J. B. Talbot, J. Electrochem. Soc., 142, 775 (1995).
18. N. Zech, E. J. Podlaha, and D. Landolt, J. Appl. Electrochem., 28, 1251 (1998).
19. N. Zech, E. J. Podlaha, and D. Landolt, J. Electrochem. Soc., 146, 2886 (1999).
20. N. Zech, E. J. Podlaha, and D. Landolt, J. Electrochem. Soc., 146, 2892 (1999).
21. N. Fenineche, C. Coddet, and A. Saida, Surf. Coat. Technol., 41, 75 (1990).
22. D. Golodnitsky, N. V. Gudin, and G. A. Volyanuk, J. Electrochem. Soc., 147, 4156 (2000).
23. A. Bai and C.-C. Hu, Electrochim. Acta, 47, 3447 (2002).
24. D. Golodnitsky, Yu. Rosenberg, and A. Ulus, Electrochim. Acta, 47, 2707 (2002).
25. D.-Y. Park, R. Y. Song, J. M. Ko, B. Y. Yoo, and N. V. Myung, Electrochem. Solid-State Lett., 8, C23 (2005).
26. B.-Z. Lee and D. N. Lee, Acta Mater., 46, 3701 (1998).
27. Electronic Thin Film Science for Electrical Engineers and Materials Scientists, K.-N. Tu, J. W. Mayer, and L. C. Feldman, Editors, Chap., Macmillan Publishing Company, New York (1992).
28. Modern Electroplating, 4th ed., G. A. Di Bari, M. Schlesinger, and M. Paunovic, Editors, pp. 139-199, Wiley-Interscience, New York (2000).
29. J. B. Kushner, Met. Finish., 56, 81 (1958).
30. F. A. Smidt, Int. Mater. Rev., 35, 61 (1990).
31. W. Esinger, Rev. Sci. Instrum., 63, 5217 (1992).
32. H. Leplan, J. Y. Robic, and Y. Pauleau, J. Appl. Phys., 79, 6926 (1996).
33. H. Leplan, B. Geenen, and J. Y. Robic, J. Appl. Phys., 78, 962 (1995).
34. S. Tamulevičius, Vacuum, 51, 127 (1998).