Thermal instability of Ni electrodeposits applied in replication of optical recording devices

Acta Materialia

Volumn 47, Issue 8, 1999, Pages 2553-2566

  Czerwinski, F ^a   Zielinska Lipiec, A ^b   Szpunar, J A ^a  

^a MCGILL UNIVERSITY   (Canada)

^b AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRYSTAL MICROSTRUCTURE; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; OPTICAL DEVICES; OPTICAL RECORDING; TEXTURES; THERMODYNAMIC STABILITY; X RAY CRYSTALLOGRAPHY;

OPTICAL RECORDING DEVICES;

NICKEL;

EID: 0032680748     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00063-4     Document Type: Article

References (43)

1. Brusic, V., Horkans, J. and Barclay, D. J., in Advantages in Electrochemical Science and Engineering, Vol. 1, ed. H. Gerischer and C. W. Tobias. VCH, Wien, 1990, p. 249
2. Osaka, T. and Homma, T., Electrochem. Soc. Interface, 1995, summer, 42
3. Wrobel J.J. Solid St. Technol. 32(6):1989;103.
4. Lessor R. Defense Electronics. 9:1993;27.
5. Czerwinski F. J. Mater. Sci. 33:1998;3831.
6. Suoninen E.J., Hakkarainen T. J. Mater. Sci. 3:1968;446.
7. Jacobson B.E., Sliwa J.W. Plating and Surface Finishing. 9:1979;42.
8. Bunge, H. J., Texture Analysis in Materials Science. Butterworth, London, 1982
9. Bennett, J. M. and Mattsson, L., Introduction to Surface Analysis and Scattering. Optical Society of America, Washington, DC, 1989
10. Grutter P., Zimmermann-Edling W., Brodbeck D. Appl. Phys. Lett. 60:1986;930.
11. Cullity, B. D., Elements of X-ray Diffraction. Addison-Wesley, London, 1978
12. Froment M., Maurin G. J. Microsc. 7:1968;37.
13. Karayannis H.S., Patermarakis G. Electrochim. Acta. 40:1995;1079.
14. Li D., Szpunar J.A. Electrochim. Acta. 42:1997;37.
15. Fionova L.K. Mater. Chem. Phys. 37:1994;201.
16. Sutton, A. P. and Baluffi, R. W., Interfaces in Crystalline Materials. Clarendon Press, Oxford, 1995
17. Morawiec A., Szpunar J.A., Hinz D.C. Acta metall. mater. 41:1993;2825.
18. Grimmer H., Bollmann M., Warrington D.H. Acta crystallogr. 30:1974;197.
19. Brandon D.G. Acta metall. 14:1966;1479.
20. Tabor, D., The Hardness of Metals. Clarendon Press, Oxford, 1951
21. Wilcox B.A., Clauer A.H. Acta metall. 20:1972;743.
22. Dahlgren S.D., Nicholson W.L., Merz M.D., Bollman W., Devlin J.F., Wang R. Thin Solid Films. 40:1977;345.
23. Thompson A.W., Saxton H.J. Metall. Trans. 4:1973;1599.
24. Czerwinski F., Li H., Megret F., Szpunar J.A., Clark D.G., Erb U. Scripta mater. 37:1997;1967.
25. Czerwinski F., Palumbo G., Szpunar J.A. Scripta mater. 39:1998;1359.
26. Czerwinski, F. and Szpunar, J. A., Corros. Sci., 1999, 41, 729
27. Lee D.N. Mater. Res. Soc. Proc. 427:1996;167.
28. Lee D.N., Kang S., Yang J. Plating and Surface Finishing. 5:1995;76.
29. Mehta S.C., Smith D.A., Erb U. Mater. Sci. Engng. A203:1995;177.
30. Kaur, I., Gaust, W. and Kozma, L. (ed.), Handbook of Grain and Interface Boundary Diffusion Data, Vol. 2. Ziegler Press, Stuttgart, 1989, p. 1037
31. Hayakawa Y., Szpunar J.A. Acta mater. 45:1997;1285.
32. Hayakawa Y., Szpunar J.A. Acta mater. 45:1997;3721.
33. Greenwood G.W., Boltax A. J. nucl. Mater. 5:1964;234.
34. Farrell K., Houston J.T. Metall. Trans. 1:1970;1979.
35. Watanabe T. Mater. Sci. Forum. 46:1989;25.
36. Phillpot S.R., Wolf D., Gleiter H. J. appl. Phys. 78:1995;847.
37. Phillpot S.R., Wolf D., Gleiter H. Scripta metall. mater. 33:1995;1245.
38. Wunderlich W., Ishida Y., Maurer R. Scripta metall. mater. 24:1990;403.
39. Czerwinski, F., Zielinska-Lipiec, A. and Szpunar, J. A., in Textures of MaterialsICOTOM-11, ed. Z. Liang, L. Zuo and Y. Cho. Inter. Acad. Publishers, Beijing, 1996, p. 1132
40. Czerwinski F. J. electrochem. Soc. 143:1996;3327.
41. Czerwinski F. Electrochim. Acta. 44:1998;667.
42. Czerwinski F. Protective Coatings (Warsaw). 99:1989;9.
43. Czerwinski F. Protective Coatings (Warsaw). 104:1990;7.