An all-glass chip-scale MEMS package with variable cavity pressure

Journal of Micromechanics and Microengineering

Volumn 16, Issue 11, 2006, Pages 2488-2491

  Sparks, Douglas ^a   Trevino, Jacob ^a   Massoud Ansari, Sonbol ^a   Najafi, Nader ^a  

^a Integrated Sensing Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS BONDING; HEAVY METALS; MICROELECTROMECHANICAL DEVICES; OPTICAL SENSORS; SEMICONDUCTING GLASS; SILICON WAFERS;

FLUIDIC FEEDTHROUGHS; GLASS WAFERS; VARIABLE CAVITY PRESSURE; WAFER TO WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 33750582872     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/11/033     Document Type: Article

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