Effect of surface roughness on droplet bouncing in droplet-based manufacturing processes

CIRP Annals - Manufacturing Technology

Volumn 55, Issue 1, 2006, Pages 209-212

  Hsiao, Wen Kai ^a   Chun, Jung Hoon ^a   Saka, Nannaji ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Rapid prototyping; Soldering; Surface roughness

Indexed keywords

DEPOSITION; LIQUID METALS; MANUFACTURE; RAPID PROTOTYPING; SOLDERING;

DROPLET BOUNCING; LIQUID METAL DROPLETS; SOLDER BUMPING;

SURFACE ROUGHNESS;

EID: 33750057397     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60400-4     Document Type: Article

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