Effects of surface roughness on solder bump formation by direct droplet deposition

CIRP Annals - Manufacturing Technology

Volumn 52, Issue 1, 2003, Pages 161-164

  Chun, J H ^a   Hsiao, W ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Electronics packaging; Precision spray deposition; Surface roughness

Indexed keywords

DENSITY (SPECIFIC GRAVITY); DEPOSITION; GOLD; MORPHOLOGY; SOLDERING; SUBSTRATES; SURFACE ROUGHNESS; TIN;

DIRECT DROPLET DEPOSITION; DIRECT SOLDER BUMPING; DROPLET BOUNCING; SOLDER BUMP FORMATION;

ELECTRONICS PACKAGING;

EID: 0042844630     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60555-1     Document Type: Article

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