Process control and monitoring with laser interferometry based endpoint detection in chemical mechanical planarization

IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop

Volumn , Issue , 1998, Pages 377-384

  Chan, David A ^a   Swedek, Bogdan ^a   Wiswesser, Andreas ^a   Birang, Manush ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CHEMICAL POLISHING; DATA ACQUISITION; INTERFEROMETRY; LASER APPLICATIONS; METAL CLEANING; PROCESS CONTROL;

CHEMICAL MECHANICAL POLISHING (CMP);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032257726     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)