Signal analysis of the end point detection method based on motor current

Microelectronic Engineering

Volumn 66, Issue 1-4, 2003, Pages 472-479

  Kim, Sang Yong ^a   Park, Chang Jun ^b   Seo, Yong Jin ^b  

^a ANAM Semiconductor Co Inc   (South Korea)

^b Daebul University   (South Korea)

Author keywords

Chemical mechanical polishing (CMP); End point detection (EPD); Motor current (MC); Pad conditioning; Shallow trench isolation (STI)

Indexed keywords

ELECTRIC CURRENTS; OSCILLATIONS; SIGNAL PROCESSING; SPURIOUS SIGNAL NOISE;

PAD CONDITIONING; SHALLOW TRENCH ISOLATION (STI);

CHEMICAL MECHANICAL POLISHING;

EID: 0037391671     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00930-9     Document Type: Conference Paper

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